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Amkor Technology Develops Industry's Only Fully Automated System for Packaging and Testing Multi-Media Cards
CHANDLER, Ariz.--(BUSINESS WIRE)--Aug. 15, 2001--In a further
expansion of its system-in-package capabilities, Amkor Technology
(Nasdaq:AMKR) has developed the industry's only fully automated system
for packaging and testing multi-media cards.
By doing so, Amkor is positioning itself to capture a large share
of manufacturing of these popular memory storage devices used
extensively in portable and hand-held applications.
The keys to Amkor's proprietary process include its ability to
automatically implant the multi-media die assembly into the MMC
housing, and its use of multiple test points designed into the package
substrate for easy test access and assurance of maximum fault
detection. Prior to development of Amkor's automated process, the
operation was performed manually.
Conducting tests for assembly defects, functionality, programming
and compatibility prior to final assembly reduces test and handling
time, and gives greater assurance of reliability.
The over-molded die assembly, which also is packaged by Amkor,
typically consists of multiple components, including memory, passives
and a micro-controller. Amkor's automated process deposits adhesive
material on the MMC housing and then attaches it to the die assembly
with placement accuracy of .5 mil. The bottom of the die assembly
incorporates a seven-pin connector that corresponds with the connector
in the end-use application.
MMCs are assembled to a standard 24 mm x 32 mm x 1.4 mm form
factor. Memory capacity depends on the design of the silicon die
inserted into the MMC, but typically hold 16 or 32 megabytes of
information - music, text, photographs or other data. By stacking
multiple memory chips into the MMC, Amkor is able to double the memory
capacity to 64 MB without increasing the dimensions of the card.
``These innovations will help Amkor keep the packaging and test
costs for MMCs at a very competitive level,'' said Paul Hoffman, senior
vice president of Amkor's System in Package business unit.
Amkor established its MMC manufacturing capability early last year
through close collaboration with SanDisk, its initial MMC customer.
Over the past year Amkor has produced more than one million
multi-media cards for a variety of customers.
Industry analyst IDC estimates the market for multi-media cards to
grow from 3.1 million in 2000 to more than 22.7 million in 2004. In
order to better serve the growing segment of that market, Amkor has
expanded its system-in-package operations to incorporate full turn-key
services, including substrate layout and design, assembly, mold,
mechanical lid assembly, test, device programming, labeling, drop
shipment and supply chain management.
``This means customers can send us their wafers and their
specifications and we'll do the rest, including sending their product
to a retailer if requested,'' Hoffman said.
About Amkor Technology: Amkor Technology, Inc. is the world's
largest provider of contract microelectronics manufacturing solutions.
The company offers semiconductor companies and electronics OEMs a
complete set of microelectronic design and manufacturing services,
including deep sub-micron wafer fabrication; wafer probe, wafer
mapping, characterization and reliability testing; IC packaging design
and assembly; multi-chip module design and assembly; and final
testing. More information on Amkor is available from the company's SEC
filings and on Amkor's web site: www.amkor.com.
Contact:
Amkor Technology, Inc.
Media:
Patrick McKinney
Sr. VP - Corp. Marketing
480/821-2408 ext. 5179
pmcki@amkor.com
Investors:
Jeff Luth
V P Investor Relations
610/431-9600
jluth@amkor.com
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